OC705 LD/PD 4-sided Inspection System

4 direction vision inspection system

Resolution down to 0.15um

Detection of 9 bond pad and emitting bar defects

Detection of 12 dielectric film and cleaved surface defects

Automatic tracking system for the emitting bar

Automatic loading/unloading system

晶粒4面檢測

0.15um高解析端面檢測能力

9項電極、發光條檢測

12項介質膜、解理區檢測

自動追蹤發光條、減少誤判

可手動圈選檢測位置和範圍

自動上下料檢測分選

OR320 TO-CAN Die Attach/Wire Bond 3D Inspection System and Sorter

> 3D repeatability down to 1um

> Multilayer inspection in 2D/3D for high productivity

> Pad size and positioning measurement

> Loop height, broken wire, sagging wire and wire sweep detection

> Crossed wire inspection

> Automatic loading system with 16 magazines

> Automatic sorting system with 16 trays

> 3D重現精度1um

> 2D/3D單次多層、超高速檢測

> 焊點位置、尺寸檢測

> 線弧高、斷線、線偏、塌線檢測

> 交叉線距檢測

> 自動進料、支援16個彈匣

> 自動分選16個彈匣、16個Tray盤出料