OC211 PD single-sided Inspection and Sorting System

One direction vision inspection system

Resolution down to 0.55um

Detection of multiple bond pad and emitting bar defects

Detection of multiple dielectric film and cleaved surface defects

Automatic tracking system for the emitting bar

10 inch frame/ring handling capability

晶片單面檢測

最高檢測精度0.55um

多項電極、發光條檢測

多項介質膜、解理區檢測

自動追蹤發光條、減少誤判

可手動圈選檢測位置和範圍

支持10吋膠環/鐵環

OC705 PD 4-sided Inspection System

4 direction vision inspection system

Resolution down to 0.15um

Detection of 9 bond pad and emitting bar defects

Detection of 12 dielectric film and cleaved surface defects

Automatic tracking system for the emitting bar

Automatic loading/unloading system

晶粒4面檢測

0.15um高解析端面檢測能力

9項電極、發光條檢測

12項介質膜、解理區檢測

自動追蹤發光條、減少誤判

可手動圈選檢測位置和範圍

自動上下料檢測分選

OR320 TO-CAN Die Attach/Wire Bond 3D Inspection System and Sorter

> 3D repeatability down to 1um

> Multilayer inspection in 2D/3D for high productivity

> Pad size and positioning measurement

> Loop height, broken wire, sagging wire and wire sweep detection

> Crossed wire inspection

> Automatic loading system with 16 magazines

> Automatic sorting system with 16 trays

> 3D重現精度1um

> 2D/3D單次多層、超高速檢測

> 焊點位置、尺寸檢測

> 線弧高、斷線、線偏、塌線檢測

> 交叉線距檢測

> 自動進料、支援16個彈匣

> 自動分選16個彈匣、16個Tray盤出料