LS250 LED Die Attach/Wire Bond Inspection System

Resolution down to 1.5um

Applied in fine-pitch, EMC and side-view products in one system

High throughput 300K UPH

Detection of 11 die attach defects

Detection of 15 wire bond defects

Detection of 3 substrate defects

Automatic loading/unloading system

最高檢測精度1.5um

小間距、EMC、側光型產品皆可共用

300K UPH 超高速檢測

11項固晶缺陷檢測

15項焊線缺陷檢測

3項載板缺陷檢測

全基板尺寸適用、自動進出料

LR220 LED Chip Inspection System

> 2/4 inch and 4/6 inch wafer handling capability

> Applied in normal, flip chip, vertical products in one system

> Support color inspection

> Maximum size up to 180mil

> Surface, bond pad, scribe line, passive film defect detection

> Market-approved inspection system in Taiwan for 10 years

> 2/4吋晶圓共用、4/6吋晶圓共用

> 一般型、覆晶、垂直型產品皆可共用

> 支援彩色檢測

> 最大可檢180mil晶粒、RGBA產品共用

> 表面、電極、切割道、圖型等全自動全檢

> 十年實績、熱銷機種

LW211 LED Epi & CoW Inspection System

2/4/6 inch wafer handling capability

Applied in normal, flip-chip, vertical products in one system

Support alignment shift measurement for mask

A single-tool solution for both epi and patterned wafer inspection

Market-approved inspection system in Taiwan for 10 years

2/4/6吋晶圓共用

一般型、覆晶、垂直型產品皆可共用

支援光罩對位偏移量測

11項磊晶缺陷檢測

12項黃光段檢測

十年實績、熱銷機種