Semicondutor

ER933 Post Dicing Wafer 2D Inspection System

The ER933 is designed to support the semiconductor industry to the high production volume environment and 2D inspection solution for post dicing.

Key Features

  • Resolution down to 0.5um
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  • High-precision chip alignment
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  • Detection of 21 chip pattern defects
  • Detection of 18 sawn line defects
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  • Detection of 14 probing mark defects
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  • Automatic defect binning and classification
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  • Off-line review inspection system
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  • Specially designed for post dicing inspection
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