optic

OR320 TO-CAN Die Attach/Wire Bond 2D Inspection System and Sorter

The OR320 offers high performance and assembly inspection by incorporating a variety of wire defection and surface metrology in TO-CAN package.

Key Features

  • High-speed 2D inspection for multilayer structures
  • Pad size and positioning measurement
  • Broken wire and wire sweep detection
  • Crossed wire inspection
  • Automatic loading system with 16 magazines
  • Automatic sorting system with 16 trays