Semicondutor

SS250 IC Die Attach /Wire Bond 2D Inspection System

The SS250 is not only designed for detection of various detects in IC package process, such as die attach and wire bond but also provides a 2D inspection solution for stacked ICs.

Key Features

  • IC Die Attach /Wire Bond 2D Inspection System
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  • Resolution down to 1.5um
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  • Multilayer inspection for high productivity
  • Detection of 15 die attach defects
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  • Detection of 31 wire bond defects
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  • Enhance micro-crack inspection function
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  • Applied to a variety of substrate sizes and layout
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  • Automatic loading/unloading system
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