LED & SILICON CHIP

LS250 LED Die Attach/Wire Bond 2D Inspection System

Applied in fine-pitch, EMC and side-view products in one system, the LS250 is a powerful 2D inspection tool with high throughput automation technology for the end product quality.

Key Features

  • Resolution down to 1.5um
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  • Applied in fine-pitch, EMC and side-view products in one system
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  • Throughput of up to 300K UPH
  • Detection of 11 die attach defects
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  • Detection of 15 wire bond defects
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  • Detection of 3 substrate defects
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  • Automatic loading/unloading system
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